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FPC - Rigid-Flex Circuit + HDI, Multi-layer, Double side, Single-side Design |
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| Communication - A：Rigid-Flex Circuit Design |
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| Application |
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Cell Phone Hing Main Board (R/F + Air Gap) |
| Description |
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6- Layers |
| Material Base Film |
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1 mil with 1/2 oz Cu |
| Cover Film |
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1/2 mil |
| Finished |
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Au / Ni |
| L/S |
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3 / 3 mil |
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| Application |
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Portable Device (Rigid Flex + HDI) |
| Description |
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8- Layers |
| Material Base Film |
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1 mil with 1/2 oz Cu |
| Cover Film |
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1 mil |
| Finished |
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Au / Ni |
| L/S |
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4 / 4 mil |
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| Application |
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Key Pad (Rigid Flex) |
| Description |
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4- Layers |
| Material Base Film |
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1 mil with 1/3 oz Cu |
| Cover Film |
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1/2 mil |
| Finished |
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Au / Ni |
| L/S |
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4 / 4 mil |
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